PCB Impedance Calculator

Calculate PCB trace impedance for microstrip and stripline configurations. Supports single-ended and differential pairs with dielectric constant and geometry inputs.

Characteristic Impedance (Z₀)
72.6Ω
Single-ended impedance
Effective Er
3.103
Substrate Er: 4.3 → effective: 3.103
Propagation Delay
0.149 ns/in
5.87 ns/m, velocity: 170.3 m/µs
Wavelength at {freq} MHz
6.71 in (170.3 mm)
Keep traces shorter than λ/10 to avoid transmission line effects
Geometry
w=0.15mm, h=0.2mm, t=0.035mm
w/h ratio: 0.75

Width vs. Impedance (h=0.2mm, Er=4.3)

Width (mm)Width (mil)Z₀ (Ω)
0.052.098.7
0.0753.090.0
0.13.983.1
0.1254.977.4
0.155.972.6
0.27.964.8
0.259.858.8
0.311.853.8
0.415.746.2
0.519.740.5

Common Interface Impedance Targets

InterfaceTypeTarget (Ω)Tolerance
USB 2.0Diff90±10%
USB 3.xDiff90±10%
HDMIDiff100±10%
PCIeDiff85±10%
DDR4SE40±10%
EthernetDiff100±10%
SATADiff100±10%
RF (50Ω)SE50±5%
Planning notes, formulas, and examples

About the PCB Impedance Calculator

The PCB Impedance Calculator determines characteristic impedance for printed circuit board traces in microstrip and stripline configurations. Controlled impedance is critical for high-speed digital designs, RF circuits, and any PCB carrying signals above a few hundred MHz where transmission line effects become significant.

This calculator covers the most common PCB geometries: surface microstrip (trace above a ground plane), embedded microstrip (trace with solder mask), stripline (trace between two ground planes), and differential pairs for both configurations. Each calculation uses industry-standard empirical formulas validated against field solvers.

The calculator accepts standard PCB manufacturing parameters—trace width, trace thickness, dielectric height, dielectric constant (Er), and for differential pairs, trace spacing. It outputs impedance in ohms along with effective dielectric constant, propagation delay, and wavelength at your specified frequency, helping you design PCB stackups that meet impedance targets for USB, HDMI, PCIe, DDR, and other high-speed interfaces. It also gives you a fast check on whether a chosen stackup can realistically hit the target before you send the board out.

When This Page Helps

Use this calculator when you need to size PCB traces for a target impedance instead of guessing from a rule of thumb. It is useful for high-speed digital, RF, and differential-pair layout work where stackup details matter. The result depends on geometry and dielectric values, so it is more dependable than a generic trace-width estimate.

How to Use the Inputs

  1. Select the trace configuration: microstrip, embedded microstrip, stripline, or differential pair
  2. Enter trace width, copper thickness, and dielectric height from your PCB stackup
  3. Set the dielectric constant (Er) for your substrate material (FR-4 ≈ 4.2-4.5)
  4. For differential pairs, also enter the trace spacing (gap between traces)
  5. Optionally enter the signal frequency for wavelength and propagation delay calculations
  6. Adjust parameters to meet your target impedance (typically 50Ω single-ended or 90-100Ω differential)
Formula used
Microstrip Z₀ ≈ (87/√(Er+1.41)) × ln(5.98h / (0.8w + t)) for w/h ≤ 1. Stripline Z₀ ≈ (60/√Er) × ln(4b / (0.67π(0.8w + t))). Differential: Zdiff = 2 × Z₀ × (1 − 0.48 × e^(−0.96s/h)). Where w=width, h=height, t=thickness, b=total height, s=spacing.

Example Calculation

Result: 50.2Ω (target: 50Ω)

A 6mil (0.15mm) wide trace, 1.4mil (0.035mm) thick, over 8mil (0.2mm) FR-4 (Er=4.3) gives approximately 50Ω characteristic impedance—ideal for most single-ended high-speed signals.

Tips & Best Practices

  • Always get your PCB manufacturer's actual stackup data — nominal values can differ significantly from catalog specs
  • For differential pairs, the gap between traces should be consistent along the entire length
  • Avoid routing impedance-controlled traces over splits in the ground plane — this changes the reference and impedance
  • Use your fab house's impedance calculator on their website — they calibrate to their actual manufacturing process
  • Add ±10% impedance tolerance to your requirements — PCB manufacturing varies by that much typically

PCB Stackup Design for Impedance Control

Achieving target impedance starts with stackup design. A typical 4-layer board might use: Layer 1 (signal), Layer 2 (ground), Layer 3 (power), Layer 4 (signal). The dielectric between signal and ground layers determines microstrip impedance. Common prepreg thicknesses are 3-10 mils, with trace widths calculated to hit 50Ω. Work with your PCB manufacturer early—they can recommended trace widths for their standard stackups.

High-Speed Interface Impedance Requirements

Different interfaces have specific impedance targets: USB 2.0/3.x uses 90Ω differential, HDMI uses 100Ω differential, PCIe uses 85Ω differential, DDR4 uses 40Ω single-ended, Ethernet uses 100Ω differential, and SATA uses 50Ω single-ended. Meeting these targets within ±10% ensures compliant signal quality and successful certification testing.

Manufacturing Tolerance and Testing

PCB manufacturers typically guarantee impedance within ±10% of target. They produce test coupons—small trace samples on each panel—and measure with TDR (Time Domain Reflectometry) to verify impedance. For tighter tolerances (±5%), expect higher costs. Always request impedance test reports for controlled-impedance boards and include test coupons in your panel design.

Sources & Methodology

Last updated:

Frequently Asked Questions

  • Most standards specify 50Ω single-ended (USB, PCIe, SATA) or 90-100Ω differential (USB3: 90Ω, HDMI: 100Ω, Ethernet: 100Ω, DDR: 100Ω). RF designs typically use 50Ω (test equipment) or 75Ω (video/antenna).