PCB Trace Resistance Calculator

Calculate DC resistance of PCB copper traces with temperature compensation. Compute voltage drop and power loss for any trace geometry and operating temperature.

DC Resistance
101.0 mΩ
Trace only (no vias), at 25°C
Total Resistance
101.0 mΩ
No vias in path
Voltage Drop
101.0 mV
At 1A through total path
Power Dissipation
101.03 mW
I² × R heating
Resistivity at Temp
1.758 µΩ·cm
2.0% above 20°C value
Resistance breakdown
🔵 Trace: 101.0 mΩ

Resistance vs. Width (1oz, 2in, 25°C)

Width (mil)ResistanceV-Drop at 1A (mV)
5202.1 mΩ202.1
8126.3 mΩ126.3
10101.0 mΩ101.0
1567.4 mΩ67.4
2050.5 mΩ50.5
2540.4 mΩ40.4
3033.7 mΩ33.7
5020.2 mΩ20.2
7513.5 mΩ13.5
10010.1 mΩ10.1

Temperature vs. Resistivity

Temp (°C)Resistivity (µΩ·cm)Increase from 20°C
-401.317-23.6%
01.588-7.9%
201.7240.0%
251.7582.0%
501.92711.8%
752.09721.6%
852.16425.5%
1002.26631.4%
1252.43541.3%
1502.60551.1%
Planning notes, formulas, and examples

About the PCB Trace Resistance Calculator

The PCB Trace Resistance Calculator computes the DC resistance of copper traces on printed circuit boards, accounting for trace geometry, copper weight, and operating temperature. Accurate resistance estimation is critical for power distribution network design, voltage drop budgeting, and thermal analysis. It gives you a quick way to check whether a trace is still acceptable after layout changes or temperature rise.

Copper resistivity increases with temperature—about 0.39% per degree Celsius. A trace that measures 10mΩ at room temperature will be 14mΩ at 125°C, a 40% increase that significantly affects voltage drop calculations for high-current designs. This calculator includes full temperature compensation using copper's thermal coefficient of resistance.

The tool supports both metric and imperial units, handles all standard copper weights from 0.5oz to 6oz, and provides multi-segment analysis for traces with different widths along their length. It also calculates skin effect depth for AC applications and shows how resistance varies with frequency, complementing the DC analysis with high-frequency considerations.

When This Page Helps

Use this calculator when you need to check whether a PCB trace can carry current without an excessive voltage drop or heating problem. It is useful for power-path design, copper-width tradeoffs, and spotting cases where temperature turns a marginal trace into a bad one. It also helps you compare alternate routing options before committing to a board spin.

How to Use the Inputs

  1. Enter trace width and length in your preferred units (mil, mm, or inches)
  2. Select the copper weight/thickness for your PCB stackup
  3. Set the operating temperature for temperature-compensated resistance
  4. Enter the expected current to see voltage drop and power dissipation
  5. Add multiple trace segments with different widths for complex routing
  6. Check AC resistance at your signal frequency if skin effect matters
Formula used
R = ρ × L / A, where ρ(Cu,20°C) = 1.724×10⁻⁶ Ω·cm. Temperature factor: ρ(T) = ρ₂₀ × (1 + 0.00393 × (T − 20)). A = width × thickness. Skin depth δ = √(ρ / (π × f × µ₀)), where µ₀ = 4π×10⁻⁷. Voltage drop = I × R. Power = I² × R.

Example Calculation

Result: R = 124.9 mΩ, V_drop = 124.9 mV, P = 124.9 mW

10 mil wide, 1oz Cu trace over 2 inches at 50°C: area = 13.7 mil², R = 1.85×10⁻⁶ × 5.08cm / 8.84×10⁻⁵ cm² = 0.1249Ω. At 1A: 124.9 mV drop, 124.9 mW dissipated.

Tips & Best Practices

  • Always use operating temperature (not 25°C) for resistance calculations — the difference can be 30%+ at elevated temperatures
  • Add via resistance for each via transition in your power path (0.5-1mΩ per standard via)
  • For voltage drops over 2% of your supply rail, you need wider traces or heavier copper
  • Use copper pours tied to power nets to massively reduce distribution resistance
  • Verify calculations with a 4-wire Kelvin measurement on prototype boards

Temperature Compensation in Practice

PCB designers often calculate trace resistance at room temperature and overlook the significant increase during operation. A device operating at 85°C ambient with additional self-heating can push trace temperatures to 100-120°C, increasing resistance by 25-40% compared to room temperature. For power supply accuracy, always use worst-case temperature for voltage drop budgeting.

Multi-Segment Trace Analysis

Real PCB traces often change width along their route—wider in open areas, narrower through BGA escape channels. Total resistance is the sum of each segment: R_total = Σ(ρ × Lᵢ / Aᵢ). This calculator supports multiple segments, accounting for width changes, layer transitions (with via resistance), and different copper weights on different layers.

DC vs. AC Resistance

At DC and low frequencies, current distributes uniformly through the trace cross-section. At higher frequencies, skin effect concentrates current near the surface, effectively reducing the conductive area and increasing resistance. The skin depth formula δ = √(ρ/(πfμ₀)) gives the depth at which current density falls to 1/e (37%) of the surface value. At 1 GHz, copper skin depth is only 2.1µm—much thinner than any standard copper weight.

Sources & Methodology

Last updated:

Frequently Asked Questions

  • Copper has a temperature coefficient of +0.00393/°C. At 100°C, resistance is 31.4% higher than at 20°C. Always use operating temperature, not room temperature, for voltage drop calculations in power designs.